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Model X3C09P2-30S
Rev B
Power Handling
The average power handling (total input power) of a Xinger coupler is a function of:
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Internal circuit temperature.
Unit mounting interface temperature.
Unit thermal resistance
Power dissipated within the unit.
All thermal calculations are based on the following assumptions:
Maximum mounting interface temperature is 95 C.
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The unit has reached a steady state operating condition.
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Conduction Heat Transfer through the mounting interface.
No Convection Heat Transfer.
No Radiation Heat Transfer.
The material properties are constant over the operating temperature range.
Finite element simulations are made for each unit. The simulation results are used to calculate the unit thermal
resistance. The finite element simulation requires the following inputs:
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Unit material stack-up.
Material properties.
Circuit geometry.
Mounting interface temperature.
Thermal load (dissipated power).
The classical definition for dissipated power is temperature delta ( ? T) divided by thermal resistance (R). The
dissipated power (P dis ) can also be calculated as a function of the total input power (P in ) and the thermal insertion loss
(IL therm ):
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? P in ? ? ? 1 ? 10 10
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P dis ?
? T
R
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? IL therm
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( W )
(1)
Power flow and nomenclature for an “H” style coupler is shown in Figure 1.
Available on Tape
and Reel for Pick and
Place Manufacturing.
USA/Canada:
Toll Free:
Europe :
(315) 432-8909
(800) 411-6596
+44 2392-232392
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